Developed to solve problems of conventional glass hemocytometers, C-Chip offers precise volume control and is easy to use. It is made of high-grade optical plastic and contains two or four counting chambers with a clear grid pattern.

• No coverslip required • No need to wash for reuse • No more contact to hazardous materials • Accurate and reliable • Made from quartz grade optical plastic

The silicon wafer have a diameter of 100mm and have the following approximate properties:
Type: n / Phosphor; Orientation: (100); Thickness: app. 525µm, Resistance: <10 Ohmcm. Depending on the batch thickness or resistance may vary slightly. The wafers are polished on one side. Wafer carrier/box included (no clean room quality).

Sapphire version of the FinderTOP platelets. Imprinting a FinderTOP pattern into the sample surface during high-pressure freezing enables precise alignment for cryoFIB/SEM imaging and cryoFIB lift-out for cryoTEM. The transparent sapphire HPF carriers are particularly useful for correlating LM/EM images (cryoCLEM).

• Ø3 x 0.16mm height
• Grid with clearly marked squares with side length 0.2mm (A-L / 1-12)

Achieve accurate correlation by imprinting a FinderTOP pattern in the sample surface during high pressure freezing (cryoCLEM). The pattern with unique marked squares allows precise targeting for cryoFIB/SEM volume imaging and cryoFIB lift out for cryoTEM.

• Ø3mm x 0,50mm thick
• 0,3mm cavity on one side
• Grid with unique marked squares with side length 0,2mm (columns labeled A-L / rows labeled 1-12)

Designed for mounting large sections of neuro and breast tissue and manufactured from the highest quality white glass, with an innovative positive charge coating, Histobond® + Supa Mega slides (75,2 x 50,4 x 1mm) offer exceptional adhesive properties and provide a superior coverage of reagents across the slide.

High-Pressure-Freezing (HPF) specimen carriers made of aluminum with standard thickness suitable for the following high-pressure-freezers: HPM-010, Compact 01, 02, 03, HPM 100, Leica EM ICE, Leica EM PACT1 und 2.

The carriers (planchets) are available in Type A, B and C. Packing unit 50, 100 or 200 pieces.

High-Pressure-Freezing (HPF) specimen carriers made of aluminium with optimized thickness for HPM100 and Leica EM ICE. The carriers (planchets) are available in Type A, B and C. Packing unit 50, 100 or 200 pieces.

High-Pressure-Freezing (HPF) specimen carriers made of aluminium suitable for the HPM 010 with 4,6mm diameter holder

The carriers (planchets) are available in Type A, B and C.

A complete set of tools for clean cleaving of wafers into strips and small pieces. With this set good cut cross-sections are achieved. The Wafer Cleaving Kit Standard consists of three diamond scribers, tweezers, a small and large (optional) cutting mat and a pair of pliers.

The Wafer Cleaving Kit XL contains all components of the Wafer Cleaving Kit Standard (E7642) and in addition the Lattice Scriber with a premium quality diamond tip and a pair of small sample cleaving pliers.

The silicon wafer have a diameter of 100mm and have the following approximate properties:
Doping: boron (p type); Orientation: (100); Thickness: app. 525µm, Resistance: <20 Ohmcm. Depending on the batch thickness or resistance may vary slightly. The wafers are polished on one side. Wafer carrier/box included (no clean room quality).

The CleanBreak wafer pliers are a simple and clean way to cleave (post scribe) wafers, wafer strips and smaller pieces down to 3cm. They are 15cm long and have a jaw opening of 1,9 cm. The CleanBreak pliers come with two sets of replaceable jaws to cleave crystalline or amorphous materials.

To cleave smaller pieces than 30mm we recommend the Small Sample Cleaving Pliers.

A Fool-Proof method for the mounting of serial sections on Single Hole Grids.

These plexiglass slides are 3 x 1" (75 x 25 mm) and 1 mm thick. They prevent wrinkling and section loss while mounting sections on the grid.